Method of manufacturing ball array devices using an inspection apparatus having one or more cameras and ball array devices produced according to the method

ABSTRACT

An apparatus for three dimensional inspection of an electronic part which has a camera and illuminator for imaging a first view of the electronic part. An optical element is positioned to reflect a different view of the electronic part into the camera, and the camera thus provides an image of the electronic part having differing views of the electronic part. An image processor applies calculations on the differing views to calculate a three dimensional position of at least one portion of the electronic part.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of pending application Ser.No. 11/069,758, filed Feb. 28, 2005, which is a continuation ofapplication Ser. No. 09/351,892, filed Jul. 13, 1999, now U.S. Pat. No.6,862,365, which is a continuation-in-part of application Ser. No.09/008,243, filed Jan. 16, 1998, now U.S. Pat. No. 6,072,898. Theapplication Ser. No. 11/069,758 and U.S. Pat. Nos. 6,862,365 and6,072,898 are incorporated by reference herein, in their entireties, forall purposes.

NOTICE REGARDING COPYRIGHT

A portion of the disclosure of this patent document contains materialthat is subject to copyright protection. The copyright owner has noobjection to the facsimile reproduction by anyone of the patentdisclosure, as it appears in the Patent and Trademark Office patentfiles or records, but otherwise reserves all copyright rightswhatsoever.

FIELD OF THE INVENTION

This invention relates to three dimensional inspection of leads of ballarray devices. More particularly, the invention relates to a method forthree dimensional inspection and ball array devices manufactured usingthe three dimensional inspection method.

BACKGROUND INFORMATION

Prior art three dimensional inspection systems have involved laser rangefinding technology, moire interferometry, structured light patterns ortwo cameras. The laser range finding method directs a focused laser beamonto the Ball Grid Array, BGA, and detects the reflected beam with asensor. Elements of the BGA are determined in the X, Y and Z dimensionsutilizing a triangulation method. This method requires a large number ofmeasurement samples to determine the dimensions of the BGA resulting inlonger inspection times. This method also suffers from specularreflections from the smooth surfaces of the solder balls resulting inerroneous data.

Moire interferometry utilizes the interference of light waves generatedby a diffraction grating to produce a pattern of dark contours on thesurface of the BGA. These contours are of known distance in the Zdimension from the diffraction grating. By counting the number ofcontours from one point on the BGA to another point on the BGA, thedistance in the Z dimension between the two points can be determined.This method suffers from the problem of low contrast contour linesresulting in missed counting of the number of contours and resulting inerroneous data. This method also suffers from the contour lines mergingat surfaces with steep slopes, such as the sides of the balls on theBGA, resulting in an incorrect count of the number of contours andresulting in erroneous data.

Structured light systems project precise bands of light onto the part tobe inspected. The deviation of the light band from a straight line isproportional to the distance from a reference surface. The light bandsare moved across the part, or alternately the part is moved with respectto the light bands, and successive images are acquired. The maximumdeviation of the light band indicates the maximum height of a ball. Thismethod suffers from specular reflections due to the highly focusednature of the light bands resulting in erroneous data. This methodfurther suffers from increased inspection times due to the number ofimages required.

Two camera systems utilize one camera to view the BGA device in thenormal direction to determine X and Y dimensions and the second camerato view the far edges of the balls from an angle. The two images arecombined to determine the apparent height of each ball in the Zdimension utilizing a triangulation method. This method suffers from theneed for a higher angle of view of the ball from the second cameraresulting in looking at a point significantly below the top of the ballfor BGA's having fine pitch. This method also suffers from limited depthof focus for the second camera limiting the size of BGA's that can beinspected. This system can only inspect BGA's and not other device typessuch as gullwing and J lead devices.

The prior art does not provide two separate and opposite side viewspermitting larger BGA's to be inspected or nonlinear optics to enhancethe separation between adjacent ball images in the side perspectiveview.

It is therefore a motivation of the invention to improve the accuracy ofthe measurements, the speed of the measurements, the ability to measureall sizes and pitches of BGA's and to measure other devices includinggullwing and J lead parts in a single system.

SUMMARY OF THE INVENTION

The invention provides an apparatus for three dimensional inspection ofan electronic part, wherein the apparatus is calibrated using aprecision pattern mask with dot patterns deposited on a calibrationtransparent reticle, the apparatus for three dimensional inspection ofan electronic part comprising a camera and an illuminator for imagingthe electronic part, the camera being positioned to obtain a first viewof the electronic part, a means for light reflection positioned toreflect a different view of the electronic part into the camera, whereinthe camera provides an image of the electronic part having differingviews of the electronic part, and a means for image processing the imageof the electronic part that applies calculations on the differing viewsof the image to calculate a three dimensional position of at least oneportion of the electronic part.

The invention further comprises a ring light. The means for lightreflection could further comprise a mirror, a prism, or a curved mirror.The electronic part may be a ball grid array, balls on a wafer, or ballson a die.

The means for imaging provides the image to a frame grabber board. Theframe grabber board provides an image data output to a processor toperform a three dimensional inspection of the part.

The apparatus may further comprise a nonlinear optical element tomagnify the second image in one dimension. In the apparatus a maximumdepth of focus of a side perspective view allows for a fixed focussystem to inspect larger electronic parts, with one perspective viewimaging one portion of the electronic part and a second perspective viewimaging a second portion of the electronic part. Also, in the apparatusa maximum depth of focus of a side perspective view includes an area ofthe electronic part including a center row of balls. Furthermore, all ofthe balls on the electronic part may be in focus resulting in twoperspective views for each ball.

The invention comprises a means for inspecting gullwing and J leaddevices.

According to one embodiment, a method is practiced for manufacturing aball array device having plural leads. The method includes providing afixed optical imaging system with at least one camera, and calibratingthe fixed optical imaging system with a planar precision patterndisposed in a fixed position. The method further includes, and obtaininga single bottom view image, as well as a single side view image, of theleads using the calibrated system, and calculating an inspection resultby combining information from the single bottom view image and thesingle side view image. The ball array device is selected as amanufactured product using the calculated inspection result.

According to another embodiment, a method is practiced for manufacturinga ball array device having plural leads. The method includes providing afixed optical imaging system with at least one camera, and calibratingthe fixed optical imaging system with a planar precision patterndisposed in a fixed focus position. The method further includesobtaining, using the calibrated system, a bottom view image with donutshaped reflections from the leads and a side view image with crescentshaped reflections from the leads. The method further includes findinglocations of the donut shaped reflections from the leads and locationsof the crescent shaped reflections from the leads, and then calculatinga Z value for each lead by combining information from the locations ofthe donut shaped reflections and the locations of the crescent shapedreflections. A coplanarity value for the ball array device is calculatedby using the Z value for each lead, and an inspection result isdetermined by comparing the coplanarity value to a predeterminedtolerance value. The ball array device is selected as a manufacturedproduct based upon the inspection result.

According to yet another embodiment, a method is practiced formanufacturing a ball array device having plural leads. The methodincludes providing an imaging system with at least one camera, at leastone lens, at least one illumination source, at least one processor andmemory. The method further includes obtaining a single bottom viewimage, as well as a single side view image, of the leads using theimaging system. The method also includes finding a subpixel location ofeach lead in the single bottom view image, and finding a subpixellocation of each lead in the single side view image. A Z value iscalculated for each lead by combining information from the subpixellocation of the lead in the single bottom view image and the subpixellocation of the same lead in the single side view image, and acoplanarity value is calculated for the ball array device by usinginformation from the Z value of each lead and parameters determinedduring a calibration. An inspection result is determined by comparingthe coplanarity value to a predetermined tolerance value, and the ballarray device is selected based upon the inspection result.

According to a further embodiment, a method is practiced formanufacturing a ball array device having plural leads. The methodincludes providing a fixed optical imaging system with at least onecamera, at least one lens, at least one illumination source, at leastone processor and memory. The imaging system is calibrated with a planarprecision pattern disposed in a fixed focus position. The method furtherincludes obtaining a single bottom view image of the leads using thecalibrated imaging system, and obtaining a single side view image of theleads using the calibrated imaging system. A subpixel location of areflection from each lead is found in the single bottom view image, anda subpixel location of a reflection from each lead is found in thesingle side view image. A Z value is calculated for each lead bycombining information from the subpixel location of a reflection fromthe lead in the single bottom view image and the subpixel location ofthe reflection from the same lead in the single side view image, and acoplanarity value is calculated for the ball array device by usinginformation from the Z value of each lead. An inspection result isdetermined by comparing the coplanarity value to a predeterminedtolerance value, and the ball array device is selected based upon theinspection result.

According to another embodiment, a method is practiced for manufacturinga ball array device having plural leads. The method includes providingan imaging system with at least one camera, and calibrating the imagingsystem with a planar precision pattern disposed in a fixed focusposition. The method further includes obtaining two differing views ofthe leads in at least one image using the calibrated imaging system,obtaining a donut shaped reflection from each lead and a crescent shapedreflection from each lead in the at least one image, and finding atleast two reference positions of each lead in the at least one image. AZ value of each lead is calculated using the at least two referencepositions of each lead, and a coplanarity value is calculated usinginformation from the Z value of each lead. An inspection result isdetermined by comparing the coplanarity value to a tolerance value, andthe ball array device is selected as a manufactured product dependingupon the inspection result.

According to another embodiment, ball array devices are provided,manufactured according to any of the methods summarized above.

According to yet another embodiment, an electronic product is providedby including a ball array device manufactured as summarized above. Theelectronic product may be, for example, an automotive controller, apersonal computer, a digital camera, a graphics board, a memory device,a motherboard, a music player, a networking device, a telephone, a cellphone, a television, a video game console and a video player.

The lead may be a curved surface lead, a ball, a ball grid array, aformed wire, a stamped metal form, a column, a contact, a pad, a pins, atowers, a post, a micro-pin, and a pedestal or similar object that canbe imaged from two separate directions.

The processor processes the pixel values to find a rotation, an Xplacement value and a Y placement value of the part relative to world Xand Y coordinates by finding points on four sides of the part.

The invention further provides for using a part definition file thatcontains measurement values for an ideal part, calculating an expectedposition for each lead of the part for a bottom view using themeasurement values from the part definition file and the X placementvalue and Y placement value.

The invention further provides for using a search procedure on the imagedata to locate the lead.

The invention further provides for determining a lead center locationand a lead diameter in pixels and storing the lead center location andlead diameter in memory.

The invention further provides for calculating an expected position of acenter of each lead in both side perspective views in the image using aknown position of each side view from calibration.

The invention further provides for using a subpixel edge detectionmethod to locate a reference point on each lead.

The invention further provides for converting the pixel values intoworld locations by using pixel values and parameters determined duringcalibration wherein the world locations represent physical locations ofthe lead with respect to world coordinates defined during calibration.

The invention further provides for the calculation of a Z height of eachlead in world coordinates in pixel values by combining a location of acenter of a lead from a bottom view with a reference point of the samelead from a side perspective view.

The invention further provides for converting the world values to partvalues using the rotation, the X placement value and the Y placementvalue to define part coordinates for the ideal part where the partvalues represent physical dimensions of the lead including leaddiameter, lead center location in X part and Y part coordinates and leadheight in Z world coordinates.

The invention further provides for comparing ideal values defined in thepart file to calculate deviation values that represent a deviation ofthe center of the lead from its ideal location. The deviation values mayinclude lead diameter in several orientations with respect to the Xplacement value and Y placement value, lead center in the X direction, Ydirection and radial direction, lead pitch in the X direction and Ydirection and missing and deformed leads, further comprising the step ofcalculating the Z dimension of the lead with respect to the seatingplane based on the Z world data.

The invention further provides for comparing the deviation values topredetermined tolerance values with respect to an ideal part as definedin the part definition file to provide a lead inspection result.

BRIEF DESCRIPTION OF THE DRAWINGS

To illustrate this invention, preferred embodiments will be describedherein with reference to the accompanying drawings.

FIG. 1A shows the apparatus of the invention for system calibration.

FIG. 1B shows an example calibration pattern and example images of thecalibration pattern acquired by the system.

FIG. 2A shows a flow chart of a method of the invention used forcalibration of the bottom view.

FIG. 2B shows a flow chart of a method of the invention used fordetermining the state values, and the X and Y world coordinates, of thebottom view of the system.

FIG. 2C shows a flow chart of a method of the invention used forcalibration of the side perspective views.

FIG. 2D shows a flow chart of a method of the invention used fordetermining the state values of the side perspective views of thesystem.

FIG. 2E shows the relationship of a side perspective angle to the ratioof the perspective dimensions to the non-perspective dimensions.

FIG. 2F shows a bottom view and a side perspective view of precisiondots used in the method for determining a side perspective view angle.

FIG. 3A shows the apparatus of the invention for part inspection.

FIG. 3B shows example images of a part acquired by the system.

FIG. 4 shows a method of the invention for the three dimensionalinspection of balls on a ball grid array.

FIGS. 5A and 5B together show a flow chart of the three dimensionalinspection method of the invention.

FIGS. 6A and 6B show an example ball of a ball grid array and associatedgeometry used in a method of the invention for determining the Zposition of the ball.

FIG. 7A shows one example of an image used in the grayscale blob methodof the invention.

FIG. 7B shows one example of an image used with the method of theinvention to perform a subpixel measurement of the ball reference point.

FIG. 8A shows a side perspective image of the calibration patternmagnified in one dimension.

FIG. 8B shows a side perspective image of the balls on a BGA, magnifiedin one dimension.

FIG. 9 shows an apparatus for presenting a BGA for inspection.

FIGS. 10A and 10B show an example ball of a ball grid array withassociated geometry as used with a method of the invention fordetermining the Z position of a ball using two side perspective views.

FIG. 11A shows the apparatus of the invention for system calibration,utilizing a single side perspective view.

FIG. 11B shows show an example calibration pattern and example images ofa calibration pattern acquired by the system, utilizing a single sideperspective view, of the invention.

FIG. 12A shows the apparatus of the invention for ball inspectionutilizing a single side perspective view.

FIG. 12B shows an example ball grid array and example images of the ballgrid array for three dimensional inspection, utilizing a single sideperspective view.

FIG. 13 shows the apparatus of the invention for the three dimensionalinspection of ball grid array devices, gullwing devices and J leaddevices.

FIG. 14 shows the apparatus of the invention for the three dimensionalinspection of parts utilizing three cameras.

FIG. 15 shows the apparatus of the invention configured with acalibration reticle 1020 for use during calibration of the state valuesof the system.

FIGS. 16A and 16B show an example calibration pattern and example imagesof the calibration pattern acquired by the single camera system.

FIG. 17 shows the apparatus of the invention configured with a part 1040to be inspected by the system.

FIGS. 18A and 18B show a part and example images of a part acquired bythe system.

DETAILED DESCRIPTION

In one embodiment of the invention, the method and apparatus disclosedherein is a method and apparatus for calibrating the system by placing apattern of calibration dots of known spacing and size on the bottomplane of a calibration reticle. From the precision dots the missingstate values of the system are determined allowing for three dimensionalinspection of balls on ball grid array devices, BGA devices or balls onwafers or balls on die. In one embodiment of the invention the systemmay also inspect gullwing and J lead devices as well as ball gridarrays.

Refer now to FIG. 1A which shows the apparatus of the inventionconfigured with a calibration reticle for use during calibration of thestate values of the system. The apparatus obtains what is known as abottom image 50 of the calibration reticle 20. To take the bottom image50 the apparatus includes a camera 10 with a lens 11 and calibrationreticle 20 with a calibration pattern 22 on the bottom surface. Thecalibration pattern 22 on the reticle 20 comprises precision dots 24.The camera 10 is located below the central part of the calibrationreticle 20 to receive an image 50 described in conjunction with FIG. 1B.In one embodiment the camera 10 comprises an image sensor. The imagesensor may be a charged coupled device array. The camera 10 is connectedto a frame grabber board 12 to receive the image 50. The frame grabberboard 12 provides an image data output to a processor 13 to perform atwo dimensional calibration as described in conjunction with FIG. 2A.The processor 13 may store an image in memory 14. The apparatus of theinvention obtains an image of a pair of side perspective views andincludes using a camera 15 with a lens 16 and a calibration reticle 20.The camera 15 is located to receive an image 60, comprising a pair ofside perspective views, described in conjunction with FIG. 1B. Fixedoptical elements 30, 32 and 38 provide a first side perspective view andfixed optical elements 34, 36, 38 for a second side perspective view.The fixed optical elements 30, 32, 34, 36 and 38 may be mirrors orprisms. As will be appreciated by those skilled in the art additionaloptical elements may be incorporated. The camera 15 is connected to aframe grabber board 17 to receive the image 60. The frame grabber board17 provides an image data output to a processor 13 to perform a twodimensional inspection as described in conjunction with FIG. 2B. Theprocessor 13 may store an image in memory 14. In one embodiment of theinvention, the apparatus may contain a nonlinear optical element 39 tomagnify the side perspective image 60 in one dimension as shown in FIG.8A. In another embodiment of the invention optical element 38 may be anonlinear element. The nonlinear optical elements 38 and 39 may be acurved mirror or a lens.

FIG. 1B show an example image 50 from camera 10 and an example image 60from camera 15 acquired by the system. The image 50, a bottom view ofdot pattern 22, shows dots 52 acquired by camera 10. The dot patterncontains precision dots 24 of known dimensions and spacing. Theprecision dots 24 are located on the bottom surface of the calibrationreticle 20. The image 60 shows two side perspective views of the dotpattern 22. A first side perspective view in image 60 contains images 62of dots 24 and is obtained by the reflection of the image of thecalibration reticle dot pattern 22 off of fixed optical elements 30, 32and 38 into camera 15. A second side perspective view in image 60contains images 66 of dots 24 and is obtained by the reflection of theimage of the calibration reticle dot pattern 22 off of fixed opticalelements 34, 36 and 38 into camera 15.

Optical element 36 is positioned to adjust the optical path length of asecond side perspective view to equal the optical path length of a firstside perspective view. Those skilled in the art will realize that anynumber of perspective views can be utilized by the invention. In oneembodiment of the invention, the maximum depth of focus of a sideperspective view includes an area of the reticle including the centerrow of dots. This allows for a fixed focus system to inspect largerparts, with one perspective view imaging half of the part and the secondperspective view imaging the other half of the part.

FIG. 2A shows a flow diagram for the calibration of the bottom view ofthe system. The method starts in step 101 by providing a transparentreticle 20 having a bottom surface containing a dot pattern 22,comprising precision dots 24 of known dimensions and spacing. The methodin step 102 provides a camera 10 located beneath the transparent reticle20 to receive an image 50. In step 103 the processor 13 sends a commandto a frame grabber 12 to acquire an image 50, comprising pixel valuesfrom the camera 10. The method then proceeds to step 104 and processesthe pixel values with a processor 13.

FIG. 2B shows a flow diagram for determining the state values of thebottom view of the system. In step 111 the method begins by finding thedots 52 in image 50, corresponding to the calibration dots 24. Theprocessor finds a dimension and position for each dot visible in image50 in subpixel values using well known grayscale methods and storesthese values in memory 14. By comparing these results to known valuesstored in memory, the processor calculates the missing state values forthe bottom calibration in steps 112 and 113. In step 112 the processor13 calculates the optical distortion of lens 11 and the camera rollangle with respect to the dot pattern 22. Step 113 calculates the pixelwidth and pixel height by comparing the subpixel data of dots 52 withthe known dimensions of the precision dot pattern 22. The pixel aspectratio is determined from the pixel width and pixel height. In step 114the processor defines the X and Y world coordinates and the Z=0 planefrom the image 50 of the precision dot pattern 22. The processor thenstores these results in memory. These results provide conversion factorsfor use during analysis to convert pixel values to world values.

FIG. 2C shows a flow diagram for the calibration of the side perspectiveviews of the system. The method starts in step 121 by providing atransparent reticle 20 having a bottom surface containing a dot pattern22, comprising precision dots 24 of known dimensions and spacing. Themethod in step 122 provides fixed optical elements 30, 32, 34, 36 and 38to reflect two perspective images of the precision dot pattern 22 intocamera 15. The method in step 123 provides a camera 15 located toreceive an image 60. In step 124 the processor 13 sends a command to aframe grabber 12 to acquire an image 60, comprising pixel values fromthe camera 15. The method then proceeds to step 125 and processes thepixel values with a processor 13.

FIG. 2D shows a flow diagram for determining the state values of theside perspective views of the system. In step 131 the method begins byfinding dots 62 in image 60, corresponding to the calibration dots 24.The processor finds a dimension and position for each dot visible,comprising the group of dots 62, in image 60 for a first sideperspective view in subpixel values and stores these values in memory14. By comparing these results to known values stored in memory, theprocessor calculates the missing state values for a side perspectiveview, comprising the group of dots 62, in steps 132 and 133. In step 132the processor 13 calculates the optical distortion of lens 16 and thecamera roll angle with respect to the dot pattern 22. In step 133 theprocessor 13 calculates the pixel width and pixel height by comparingthe subpixel data of dots 62 with the known dimensions of the precisiondots 24. The pixel aspect ratio is determined from the pixel width andpixel height. In step 134 the processor defines the X and Y worldcoordinates and the Z=0 plane from the dots 62 in image 60 of the dotpattern 22. The processor then stores these results in memory. Theseresults provide conversion factors for use during analysis to convertpixel values to world values. In step 135 the method of the inventioncomputes the side view angle. In step 136 the method is repeated for asecond side perspective view using the dots 66 in image 60.

FIG. 2E shows the relationship of a side perspective angle to the ratioof the perspective dimension to the non-perspective dimension. Ray 171,172, and 173 defining point 181 is parallel to ray 174, 175 and 176defining point 182. Point 181 and point 182 lie on a plane 170 parallelto a plane 180. The intersection of ray 175 and ray 176 define point186. The intersection of ray 176 and ray 172 define point 184. Theintersection of ray 173 and ray 172 define point 187. The intersectionof ray 174 and ray 172 define point 183. The reflecting plane 179intersecting plane 180 at an angle D is defined by ray 172 and ray 175and the law of reflectance. Ray 172 and ray 175 intersect plane 170 atan angle 177. Referring to FIG. 2E it can be shown:tan θ=C/D _(B)C/sin A=L/sin A Therefore: C=Lcos θ=D _(S) /L=D _(S) /CC=D _(S)/cos θSubstituting:tan θ=(D _(S)/cos θ)/D _(B) =D _(S) /D _(B) cos θ(tan θ)(cos θ)=D _(S) /D _(B) sin θθ=arcsin(D _(S) /D _(B))

FIGS. 2F show a bottom view and a side perspective view of precisiondots used in the method for determining a side perspective view angle177 as shown in FIG. 2E of the system. A bottom view image 200comprising precision dots 201, 202 and 203 of known spacing anddimensions from the calibration method described earlier can be used toprovide a reference for determination of a side perspective view angle177. The value D_(H) and D_(B) are known from the bottom viewcalibration. A side perspective view image 210 comprising precision dots211, 212 and 213, corresponding to bottom view dots 201, 202 and 203respectively, of known spacing and dimensions D_(S) and D_(h) from thecalibration method described earlier, can be used to determine the sideview perspective angle. The ratio of (D_(h)/D_(H)) from the bottom image200 and the side perspective image 210 can be used in the bottom view tocalibrate D_(B) in the same units as the side perspective view asfollows:D _(Bcal) =D _(B)(D _(h) /D _(H))Substituting into the equation for the side perspective view angle 177described earlier yields:θ=arcsin(D _(S) /D _(B))=arcsin(D _(S) /D _(Bcal))θ=arcsin(D _(S) D _(H) /D _(B) D _(h))

FIG. 3A shows the apparatus of the invention for a three dimensionalinspection of the balls of a ball grid array. The apparatus of theinvention includes a part 70 to be inspected. The apparatus furtherincludes a camera 10 with a lens 11, located below the central area ofpart 70, to receive a bottom image 80, described in conjunction withFIG. 3B, of part 70. The camera 10 is connected to a frame grabber board12 to receive the image 80. The frame grabber board 12 provides an imagedata output to a processor 13 to perform a two dimensional inspection asdescribed in conjunction with FIG. 3A. The processor 13 may store animage in memory 14. The apparatus of the invention obtains an image of apair of side perspective views with a camera 15 and a lens 16. Thecamera 15 is located to receive an image 90, comprising a pair of sideperspective views, described in conjunction with FIG. 3B and utilizingfixed optical elements 30, 32 and 38 for a first side perspective viewand fixed optical elements 34, 36 and 38 for a second side perspectiveview. In one embodiment of the invention, the apparatus may contain anonlinear optical element 39 to magnify the side perspective image 60 inone dimension as shown in FIG. 8B. In another embodiment of theinvention optical element 38 may be the nonlinear element. The fixedoptical elements 30, 32, 34, 36 and 38 may be mirrors or prisms. As willbe appreciated by those skilled in the art additional optical elementsmay be incorporated without deviating from the spirit and scope of theinvention. The camera 15 is connected to a frame grabber board 17 toreceive the image 90. The frame grabber board 17 provides an image dataoutput to a processor 13 to calculate the Z position of the balls,described in conjunction with FIG. 3B. The processor 13 may store animage in memory 14.

FIG. 3B show an example image 80 from camera 10 and an example image 90from camera 15 acquired by the system. The image 80 shows the bottomview of the balls located on the bottom surface of a part 70. The image90 shows two side view perspectives of the balls located on part 70. Afirst side perspective view in image 90 contains images of balls 91 andis obtained by the reflection of the image of the part 70 off of fixedoptical elements 30, 32 and 38 into camera 15. A second side perspectiveview in image 90 contains images of balls 92 and is obtained by thereflection of the image of the part 70 off of fixed optical elements 34,36 and 38 into camera 15. Optical element 36 is positioned to adjust theoptical path length of a second side perspective view to equal theoptical path length of a first side perspective view. In one embodimentof the invention, the maximum depth of focus of a side perspective viewjust includes an area of the part including the center row of balls.This allows for a fixed focus system to inspect larger parts, with oneperspective view imaging at least half of the part and the secondperspective view imaging at least the other half of the part. Thoseskilled in the art will realize that any number of perspective views canbe utilized by the invention. In another embodiment of the invention,all of the balls are in focus from both side perspective views resultingin two perspective views for each ball. This permits two Z calculationsfor each ball as shown in conjunction with FIGS. 10A and 10B.

FIG. 4 shows a flow diagram for the three dimensional inspection ofballs on a ball grid array. The method starts in step 141 by providing apart 70 having balls 71 facing down. The method in step 142 provides acamera 10 located beneath the part 70 to receive an image 80. In step143 a frame grabber 12 is provided to receive the image 80 from camera10. In step 144, fixed optical elements are provided for obtaining twoside perspective views of the part 70. A first optical path is providedby optical elements 30, 32 and 38. A second optical path is provided byoptical elements 34, 36 and 38. A second camera 15 receives an image 90of two side perspective views in step 145. In step 146 a second framegrabber board 17 is provided to receive the image 90 from camera 15. Aprocessor 13 sends a command to frame grabbers 12 and 17 to acquireimages 80 and 90 comprising pixel values from cameras 10 and 15. Themethod then proceeds to step 147 and processes the pixel values with aprocessor 13 to obtain three dimensional data about part 70.

The invention contemplates the inspection of parts that have ball shapedleads whether or not packaged as a ball grid array. The invention alsocontemplates inspection of leads that present a generally curvilinearprofile to an image sensor.

FIGS. 5A and 5B together show a flow chart of the three dimensionalinspection method of the invention. The process begins in step 151 bywaiting for an inspection signal. When the signal changes state, thesystem initiates the inspection. The processor 13 sends a command toframe grabber boards 12 and 17 to acquire images 80 and 90 respectivelyof part 70 having balls 71. In step 152, camera 10 captures an image 80comprising pixel values and camera 15 captures an image 90 comprisingpixel values and the processor stores the images in memory 14. Theimages comprise information from both a bottom view and two sideperspective views as shown in FIG. 3B. In step 153, the inspectionsystem sends a signal to a part handler shown in FIG. 9 to allow thepart handler to move the part out of the inspection area and allows thenext part to be moved into the inspection area. The handler may proceedwith part placement while the inspection system processes the storedimage data.

The inspection system processes the pixel values of the stored image 80in step 154 to find a rotation, and X placement and Y placement of thepart relative to the world X and Y coordinates. The processor determinesthese placement values finding points on four sides of the body of thepart. In step 155, the processor employs a part definition file thatcontains values for an ideal part.

By using the measurement values from the part definition file and theplacement values determined in step 154, the processor calculates anexpected position for each ball of the part for the bottom viewcontained in image 80.

The processor employs a search procedure on the image data to locate theballs 81 in image 80. The processor then determines each ball's centerlocation and diameter in pixel values using grayscale blob techniques asdescribed in FIG. 7A. The results are stored in memory 14.

The processor proceeds in step 156 to calculate an expected position ofthe center of each ball in both side perspective views in image 90 usingthe known position of each side view from calibration. The processoremploys a subpixel edge detection method described in FIG. 7B to locatea reference point on each ball in step 157. The results are stored inmemory 14.

Now refer to FIG. 5B. In step 158 the processor converts the storedpixel values from steps 154 and 157 into world locations by using pixelvalues and parameters determined during calibration. The world locationsrepresent physical locations of the balls with respect to the worldcoordinates defined during calibration.

In step 159 the Z height of each ball is calculated in world coordinatesin pixel values. The method proceeds by combining the location of thecenter of a ball from the bottom view 80 with the reference point of thesame ball from a side perspective view in image 90 as described in FIGS.6A and 6B. The processor then converts the world values to part valuesusing the calculated part rotation, and X placement and Y placement instep 160 to define part coordinates for the ideal part. The part valuesrepresent physical dimensions of the balls such as ball diameter, ballcenter location in X part and Y part coordinates and ball height in Zworld coordinates.

In step 161 these part values are compared to the ideal values definedin the part file to calculate the deviation of each ball center from itsideal location. In one example embodiment of the invention the deviationvalues may include ball diameter in several orientations with respect tothe X and Y part coordinates, ball center in the X direction, Ydirection and radial direction, ball pitch in the X direction and Ydirection and missing and deformed balls. The Z world data can be usedto define a seating plane, using well known mathematical formulas, fromwhich the Z dimension of the balls with respect to the seating plane canbe calculated. Those skilled in the art will recognize that there areseveral possible definitions for seating planes from the data that maybe used without deviating from the spirit and scope of the invention.

In step 162 the results of step 161 are compared to predeterminedthresholds with respect to the ideal part as defined in the part file toprovide an electronic ball inspection result. In one embodiment thepredetermined tolerance values include pass tolerance values and failtolerance values from industry standards. If the measurement values areless than or equal to the pass tolerance values, the processor assigns apass result for the part. If the measurement values exceed the failtolerance values, the processor assigns a fail result for the part. Ifthe measurement values are greater than the pass tolerance values, butless than or not equal to the fail tolerance values, the processordesignates the part to be reworked. The processor reports the inspectionresult for the part in step 163, completing part inspection. The processthen returns to step 151 to await the next inspection signal.

FIGS. 6A and 6B show an example ball of a ball grid array and associatedgeometry used in a method of the invention for determining the Zposition of the ball. The method determines the Z position of a ballwith respect to the world coordinates defined during calibration. Usingparameters determined from the calibration procedure as shown in FIGS.2B and 2D to define a world coordinate system for the bottom view andthe two side perspective views, comprising world coordinate plane 250with world coordinate origin 251 and world coordinate axis X 252, Y 253and Z 254 shown in FIG. 6A, and a pair of images 80 and 90 as shown inFIG. 3B, the processor computes a three dimensional location.

Now refer to FIG. 6A. The processor locates a point 258 on the worldplane 250 determined by a bottom view ray 255 passing through the center257 of a ball 71 on a part 70. The processor locates a side perspectiveview point 260 on the world plane 250 determined by a side perspectiveview ray 256 intersecting a ball reference point 259 on ball 71 andintersecting the bottom view ray 255 at a virtual point 261. Ray 256intersects the world plane 250 at an angle 262 determined by thereflection of ray 256 off of the back surface 263 of prism 30. The valueof angle 262 was determined during the calibration procedure.

Now refer to FIG. 6B. The distance L₁ is calculated by the processor asthe difference between world point 258, defined by the intersection ofray 255 with the Z=0 world plane 250, and world point 260, defined bythe intersection of ray 256 and the Z=0 world plane 250. The value Z isdefined as the distance between world point 261 and 258 and is relatedto L₁ as follows:tan θ₁ =Z/L ₁Z=L ₁ tan θ₁

Z can be computed by processor 13 since the angle 262 is known fromcalibration. The offset E 265 is the difference between the virtualpoint 261 defined by the intersection of ray 255 and ray 256 and thecrown of ball 71 at point 264, defined by the intersection of ray 255with the crown of ball 71, and can be calculated from the knowledge ofthe angle 262 and the ideal dimensions of the ball 71. The final valueof Z for ball 71 is:Z _(Final) =Z−E

FIG. 7A shows one example of an image used in the grayscale blob methodof the invention. The image processing method finds the location anddimensions of a ball 71 from a bottom image 80. From the expectedposition of a ball 71, a region of interest in image 80 is defined as(X1, Y1) by (X2, Y2). The width and height of the region of interest arelarge enough to allow for positioning tolerances of part 70 forinspection. Due to the design of the lighting for the bottom view (e.g.,a ring light), the spherical shape of balls 71 of part 70 present adonut shaped image where the region 281, including the perimeter of theball 71, comprises camera pixels of higher grayscale values and wherethe central region 282 comprises camera pixels of lower grayscalevalues. The remainder 283 of the region of interest 280 comprises camerapixels of lower grayscale values.

In one embodiment of the invention the processor 13 implements imageprocessing functions written in the C programming language.

The C language function “FindBlobCenter”, as described below, is calledto find the approximate center of the ball 71 by finding the averageposition of pixels that are greater than a known threshold value. Usingthe coordinates of the approximate center of the ball 71, the region 282of lower grayscale pixel values can be converted to higher grayscalevalues by calling the C language function “FillBallCenter”, as describedbelow. The exact center of the ball 71 can be found by calling the Clanguage function “FindBallCenter” which also returns an X world and Yworld coordinate. The diameter of the ball 71 can be calculated by the Clanguage function, “Radius=sqrt(Area/3.14)”. The area used in thediameter calculation comprises the sum of pixels in region 281 and 282.

FIG. 7B shows one example of an image used with the method of theinvention to perform a subpixel measurement of the ball reference point.The method of the invention finds a reference point on a ball 71 in animage 90 of a side perspective view as shown in FIG. 3B. From theexpected position of a ball 71, a region of interest 290 in image 80 isdefined as (X3, Y3) by (X4, Y4). The width and height of the region ofinterest are large enough to allow for positioning tolerances of part 70for inspection. Due to the design of the lighting for a side perspectiveview (e.g., using a light diffuser), the spherical shape of balls 71 ofpart 70 present a crescent shaped image 291 comprising camera pixels ofhigher grayscale values and where the remainder 293 of the region ofinterest 290 comprises camera pixels of lower grayscale values.

The C language function “FindBlobCenter” is called to compute theapproximate center of the crescent image 291 by finding the averageposition of pixels that are greater than a known threshold value. Usingthe coordinates of the approximate center of the crescent image 291, theC language function “FindCrescentTop” is called to determine the camerapixel, or seed pixel 292 representing the highest edge on the top of thecrescent. The camera pixel coordinates of the seed pixel are used as thecoordinates of a region of interest for determining the subpixellocation of the side perspective ball reference point.

One example of grayscale blob analysis and reference point determinationimplemented in the C language is presented as follows:

//////////////////////////////////////////////////////////// // //FindBlobCenter - finds the X,Y center of the pixels that have a valuegreater than THRESHOLD in the region (x1,y1) to (x2,y2)//////////////////////////////////////////////////////////// // longFindBlobCenter(int x1,int y1,int x2,int y2, double* pX,double* pY) { intx,y; long Found = 0; long SumX = 0; long SumY = 0; for (x=x1;x<=x2;x++){ for (y=y1;y<=y2;y++) { if (Pixel [x] [y] > THRESHOLD) { SumX += X;SumY += y; Found ++; } } } if (Found > 0) { *pX = (double)SumX /(double)Found; *pY = (double)SumY / (double)Found; } return Found; }//////////////////////////////////////////////////////////// // //FillBallCenter - fills the center of the BGA “donut” // voidFillBallCenter(double CenterX,double CenterY,double Diameter)//////////////////////////////////////////////////////////// { int x,y;int x1 = (int) (CenterX − Diameter / 4.0); int x2 = (int) (CenterX +Diameter / 4.0); int y1 = (int) (CenterY − Diameter / 4.0); int y2 =(int) (CenterY + Diameter / 4.0); for (x=x1;x<=x2;x++) { for(y=y1;y<=y2;y++) { Pixel [x] [y] = 255; } } }//////////////////////////////////////////////////////////// // //FindBallCenter - finds the X,Y center of the a BGA ball //  using thegrayscale values//////////////////////////////////////////////////////////// // longFindBallCenter(int x1,int y1,int x2,int y2, double* pX,double* pY,double* pRadius) { int x,y; long Found = 0; long Total = 0; long SumX =0; long SumY = 0; for (x=x1;x<=x2;++) { for (y=y1;y<=y2;y++) { if (Pixel[x] [y] > THRESHOLD) { SumX += x*Pixel [x] [y]; SumY += y*PixeI [x] [y];Total += Pixel [x] [y]; Found ++; } } } if (Found > 0) { *pX =(double)SumX / (double)Total; *pY = (double)SumY / (double)Total;*pRadius = sqrt((double)Found / 3.14159279); } return Found; }//////////////////////////////////////////////////////////// // //FindCresentTop - finds the X,Y top position of a BGA cresent//////////////////////////////////////////////////////////// // voidFindCresentTop(int CenterX,int CenterY,int Diameter, int* pX,int* pY) {int x,y,Edge,Max,TopX,TopY; int x1 = CenterX − Diameter / 2; int x2 =CenterX + Diameter / 2; int y1 = CenterY − Diameter / 2; int y2 =CenterY; *pY = 9999; for (x=x1;x<=x2;x++) { Max = −9999; for(y=y1;y<=y2;y++) { Edge = Pixel [x] [y] − Pixel [x] [y−1]; if (Edge >Max) { Max = Edge; TopY = y; TopX = x; } } if(TopY < *pY) { *pX = TopX;*pY = TopY; } } (c) 1997 Scanner Technologies Inc.

FIG. 8A shows a side perspective image of the calibration patternmagnified in one dimension. FIG. 8A shows a side perspective image 300of a reticle calibration pattern where the space 303 between dot 301 anddot 302 is magnified, increasing the number of lower value grayscalepixels when compared to a non magnified image.

FIG. 8B shows a side perspective image of the balls on a BGA, magnifiedin one dimension. In FIG. 8B a side perspective image 310 of two viewsare shown where the space 313 between ball image 311 and ball image 312is magnified, increasing the number of lower value grayscale pixels whencompared to a non magnified image. The increased number of lowergrayscale value pixels allows for the successful application of thesubpixel algorithm.

In another embodiment of the invention, the method and apparatusdisclosed herein is a method and apparatus for calibrating the system byplacing a pattern of calibration dots of known spacing and dimensions onthe bottom plane of a calibration reticle and for providing for two sideperspective views of each ball for the three dimensional inspection ofparts. From the precision dots the missing state values of the systemare determined allowing for three dimensional inspection of balls on BGAdevices or balls on wafers or balls on die.

FIG. 9 shows an example apparatus for presenting a BGA to the system forinspection. An overhead light reflective diffuser includes a vacuum cupassembly 6. The vacuum cup assembly may attach to a BGA part 70 havingballs 71 and suspend the BGA part 70 below the overhead light reflectivediffuser 5.

FIGS. 10A and 10B show an example ball on a ball grid array andassociated geometry for use with the method of the invention fordetermining the Z position of a ball with respect to the worldcoordinates defined during calibration, using two perspective views foreach ball. Using parameters determined from the calibration procedure asshown in FIGS. 2B and 2D to define a world coordinate system for thebottom view and the two side perspective views, comprising worldcoordinate plane 700 with world coordinate origin 701 and worldcoordinate axis X 702, Y 703 and Z 704 shown in FIG. 10A and FIG. 10B,and a pair of images 80 and 90 as shown in FIG. 3B, the processorcomputes a three dimensional location.

Now refer to FIG. 10A. The processor locates a point 709 on the worldplane 700 determined by a bottom view ray 705 passing through the center708 of a ball 717. The processor locates a first side perspective viewpoint 711 on the world plane 700 determined by a side view ray 706intersecting a ball reference point 710 on ball 717 and intersecting thebottom view ray 705 at a virtual point 714. Ray 706 intersects the worldplane 700 at an angle 715 determined by the reflection of ray 706 off ofthe back surface of prism 30. The value of angle 715 was determinedduring the calibration procedure. The processor locates a second sideperspective view point 713 on the world plane 700 determined by a sideview ray 707 intersecting a ball reference point 712 on ball 717 andintersecting the bottom view ray 705 at a virtual point 718. Ray 707intersects the world plane 700 at an angle 716 determined by thereflection of ray 707 off of the back surface of prism 34. The value ofangle 716 was determined during the calibration procedure.

Now refer to FIG. 10B. The distance L1 is calculated by the processor asthe distance between world point 709 and world point 711. The distanceL2 is calculated by the processor as the distance between world point713 and world point 709. The value Z₁ is defined as the distance betweenworld point 714 and 709 and is related to L₁ as follows:tan θ₁ =Z ₁ /L ₁Z ₁ =L ₁ tan θ₁The value Z₂ is defined as the distance between world point 718 and 709and is related to L₂ as follows:tan θ₂ =Z ₂ /L ₂Z ₂ =L ₂ tan θ₂

The average of Z₁ and Z₂ are calculated and used as the value for Z ofthe ball. This method is more repeatable and accurate than methods thatuse only one perspective view per ball.

In still another embodiment of the invention, the method and apparatusdisclosed herein is a method and apparatus for calibrating the system byplacing a pattern of calibration dots of known spacing and dimensions onthe bottom plane of a calibration reticle and for providing a singleside perspective view for the three dimensional inspection of parts.From the precision dots the missing state values of the system aredetermined allowing for three dimensional inspection of balls on BGAdevices or balls on wafers or balls on die.

FIG. 11A shows the apparatus of the invention for system calibration,utilizing a single side perspective view. The method and apparatus forcalibration of the bottom view is identical to the method and apparatusdescribed earlier in FIGS. 2A and 2B for the two side perspective viewsmethod. The apparatus for an image of a side perspective view includes acamera 15 with a lens 18 and a calibration reticle 20. The camera 15 islocated to receive an image 64 of a side perspective view comprisingdots 65, described in conjunction with FIG. 11B, and utilizing fixedoptical elements 40 and 42. The fixed optical element 40 may be a mirroror prism. The fixed optical element 42 is a nonlinear element thatmagnifies the image in one direction. In another embodiment fixedoptical element 40 may be this nonlinear element. As will be appreciatedby those skilled in the art additional optical elements may beincorporated. The camera 15 is connected to a frame grabber board 17 toreceive the image 64. The frame grabber board 17 provides an image dataoutput to a processor 13 to perform a two dimensional inspection asdescribed in conjunction with FIG. 2B. The processor 13 may store animage in memory 14.

FIG. 11B show an example calibration pattern and example images of acalibration pattern acquired by the system, utilizing a single sideperspective view, of the invention. FIG. 11B show an example image 50from camera 10 and an example image 64 from camera 15 acquired by thesystem. The image 50 showing dots 52 acquired by camera 10 includes abottom view of the dot pattern 22, containing precision dots 24 of knowndimensions and spacing, located on the bottom surface of the calibrationreticle 20. The image 64 shows a side perspective view of the dotpattern 22, containing precision dots 24 of known dimensions andspacing, located on the bottom surface of the calibration reticle 20. Aside perspective view in image 64 contains images of dots 65 and isobtained by the reflection of the image of the calibration reticle dotpattern 22 off of fixed optical element 40, passing through nonlinearelement 42 and into camera 15.

The side perspective calibration is identical to the method shown inFIG. 2C except the fixed optical elements may have different properties.

The determination of the state values for the side perspective view isidentical to the method shown in FIG. 2D except the fixed opticalelements may be different and there is only one side perspective view.The principles and relationships shown in FIG. 2E and FIG. 2F apply.

In still another embodiment employing a single side perspective view,the invention does not include the nonlinear element 42.

FIG. 12A shows the apparatus of the invention for ball inspectionutilizing a single side perspective view. The apparatus of the inventionincludes a part 70 to be inspected. The apparatus further includes acamera 10 with a lens 11, located below the central area of part 70, toreceive a bottom image 80, described in conjunction with FIG. 12B, ofpart 70. The camera 10 is connected to a frame grabber board 12 toreceive the image 80. The frame grabber board 12 provides an image dataoutput to a processor 13 to perform a two dimensional inspection asdescribed in conjunction with FIG. 12B. The processor 13 may store animage in memory 14. The apparatus for an image of a single sideperspective view includes a camera 15 with a lens 18. The camera 15 islocated to receive an image 94, comprising a single side perspectiveview, described in conjunction with FIG. 12B and utilizing fixed opticalelement 40 and nonlinear, fixed optical element 42, to magnify the sideperspective view in one dimension. In another embodiment of theinvention optical element 40 may be the nonlinear element. The fixedoptical element 40 may be a mirror or prism. As will be appreciated bythose skilled in the art additional optical elements may beincorporated. The camera 15 is connected to a frame grabber board 17 toreceive the image 94. The frame grabber board 17 provides an image dataoutput to a processor 13 to calculate the Z position of the balls,described in conjunction with FIG. 12B. The processor 13 may store animage in memory 14.

FIG. 12B shows an example ball grid array and example images of the ballgrid array for three dimensional inspection, utilizing a single sideperspective view. FIG. 12B shows an example image 80 from camera 10 andan example image 94 from camera 15 acquired by the system. The image 80shows the bottom view of the balls 71 located on the bottom surface of apart 70. The image 94 shows a side perspective view of the balls 71located on part 70. The side perspective view in image 94 containsimages of balls 95 and is obtained by the reflection of the image of thepart 70 off of fixed optical element 40 and passing through thenonlinear fixed element 42 into camera 15.

In an alternate embodiment of the invention, the system can be used toinspect other types of electronic parts in three dimensions, such as(gullwing and J lead devices. By utilizing only one camera and adding anadditional set of prisms on the reticle 400 these other devices may beinspected. The advantage of being able to inspect different devices withthe same system includes savings in cost, and floor space in thefactory. Additionally this design allows more flexibility in productionplanning and resource management.

FIG. 13 shows the apparatus of the invention for the three dimensionalinspection of ball grid array devices, gullwing devices and J leaddevices. The apparatus described in FIG. 13 allows the inspection ofBGA, gullwing and J lead devices all on the same system. The apparatusincludes a part 402 to be inspected located over the central area of atransparent reticle 400 with prisms 401 glued to the top surface toreceive side perspective views of part 402. A gullwing and J leadinspection device 21 may be integrated into the ball grid arrayinspection device. One example embodiment of such a gullwing and J leadinspection device is the “UltraVim” scanner from Scanner Technologies ofMinnetonka, Minn. The apparatus further includes a camera 10A with alens 11A, located below the central area of part 402 and reticle 400 toreceive a bottom view and side perspective views of part 402. The camera10A is connected to a frame grabber board 12A to receive an image. Theframe grabber board 12A provides an image data output to a processor 13Ato perform a three dimensional inspection of part 402. The processor 13Amay store an image in memory 14A. These components comprise the hardwareof the gullwing and J lead inspection device 21 and are shared by theball grid array inspection device as described herein.

The UltraVim is described in U.S. patent application Ser. No. 08/850,473entitled THREE DIMENSIONAL INSPECTION SYSTEM by Beaty et al., filed May5, 1997 which is incorporated in its entirely by reference thereto.

Refer now to FIG. 14. In still another embodiment of the invention, thesystem may use three cameras to image directly the bottom view and twoside perspective views as shown in FIG. 14. FIG. 14 shows the apparatusof the invention for a three dimensional inspection of the balls of aBGA. The apparatus of the invention includes a part 70, with balls 71 tobe inspected. The apparatus further includes a camera 10 with a lens 11,located below the central area of part 70, to receive a bottom image 80,described in conjunction with FIG. 12B, of part 70. The camera 10 isconnected to a frame grabber board 12 to receive the image 80. The framegrabber board 12 provides an image data output to a processor 13 toperform a two dimensional inspection as described in conjunction withFIG. 12B. The processor 13 may store an image in memory 14. Theapparatus for an image of a first side perspective view includes acamera 15 with a lens 19. The camera 15 is located to receive an image94, comprising a single side perspective view, described in conjunctionwith FIG. 12B and utilizing fixed optical element 38, to magnify theside perspective view in one dimension. The camera 15 is connected to aframe grabber board 17 to receive the image 94. The frame grabber board17 provides an image data output to a processor 13 to calculate the Zposition of the balls, described in conjunction with FIG. 12B. Theprocessor 13 may store an image in memory 14. The apparatus for an imageof a second side perspective view includes a camera 15 with a lens 19.The camera 15 is located to receive an image similar to 94, comprising asingle side perspective view, described in conjunction with FIG. 12B andutilizing fixed optical element 38, to magnify the side perspective viewin one dimension. The camera 15 is connected to a frame grabber board 17to receive the image similar to 94. The frame grabber board 17 providesan image data output to a processor 13 to calculate the Z position ofthe balls, described in conjunction with FIG. 12B. The processor 13 maystore an image in memory 14. In another embodiment, the nonlinear fixedoptical element 38 may be missing. In still another embodiment of theinvention, only one side perspective view may be utilized.

In another embodiment of the invention, the method and apparatusdisclosed herein is a method and apparatus using a single camera forcalibrating the system by placing a pattern of calibration dots of knownspacing and size on the bottom plane of a calibration reticle. From theprecision dots the missing state values of the system are determinedallowing for three dimensional inspection of balls on ball grid arraydevices, BGA devices or balls on wafers or balls on die.

Refer now to FIG. 15 which shows one example of the apparatus of theinvention configured with a calibration reticle 1020 for use duringcalibration of the state values of the system. Calibration reticle 1020is positioned to be viewed by camera 1008. Camera 1008 further comprisesa lens 1006. Camera 1008 receives a composite image of the calibrationreticle 1020, one portion of the image, through mirror 1002 and anadditional portion directly. A frame grabber 1010 receives imageinformation from the camera 1008 and provides processor 1012 with imageinformation of the calibration reticle 1020. The image information andother inspection information may be stored in memory 1014. The apparatusobtains an image 1024 showing a bottom view 1026 containing an image1031 of a precision dot 1030 and a side view 1028 containing an image1032 of precision dot 1030 of the calibration reticle 1020 shown in FIG.16A. This image 1024 is shown in FIG. 16B. To take the image 1024, theapparatus includes a means of illumination 1017, an overhead lightdiffuser 1015, the camera 1008, with lens 1006, and calibration reticle1020 with a calibration pattern 1022 on the bottom surface of thecalibration reticle 1020. A separate optical element 1002 is positionedbelow the calibration reticle 1020 to provide an additional perspectiveor side view 1028 containing an image of precision dot 1032 of thecalibration reticle 1020.

In one embodiment of the invention, the optical element 1002 maycomprise a prism. In another embodiment of the invention, the opticalelement 1002 may comprise a mirror. As will be appreciated by oneskilled in the art, the invention will work with any number of sideviews. The calibration pattern 1021 on the reticle 1020 comprisesprecision dots 1022. The camera 1008 is located below the central partof the calibration reticle 1020 to receive an image 1024 described inconjunction with FIGS. 16A and 16B. In one embodiment of the invention,the camera 1008 comprises an image sensor. The image sensor may be acharged coupled device array. The camera 1008 is connected to a framegrabber board 1010 to receive the image 1024. The frame grabber board1010 provides an image data output to a processor 1012 to perform athree dimensional calibration as described in conjunction with FIG. 16B.The principles and relationships shown in FIGS. 2E and 2F apply. Theprocessor 1012 may store an image in memory 1014.

Now refer to FIGS. 16A and 16B which show a calibration reticle 1020having precision dots 1022. FIG. 16B shows a composite image 1024 of thecalibration reticle 1020. The bottom view 1026 shows precision dot 1030with a first perspective view 1031 and a side view 1028 shows precisiondot 1030 with a second perspective view 1032. The system processorprocesses the composite image 1024 according to the system of equationsdescribed herein with the bottom view 1026 and side view 1028 providinginformation for the solution of the system of equations. The principlesand relationships shown in FIG. 2E and FIG. 2F apply.

In another embodiment of the invention, the method and apparatusdisclosed herein is a method and apparatus using a single camera for athree dimensional inspection of balls on ball grid array devices,BGA/CSP devices or balls on wafers or balls on die.

Refer now to FIG. 17 which shows the apparatus of the inventionconfigured with a part 1040 to be inspected by the system. The apparatusobtains an image 1044 showing a bottom view 1046 containing an image ofa ball 1050 and a side view 1048 containing an image of a ball 1052 ofthe part 1040. To take the image 1044, the apparatus includes a means ofillumination 1017 which may be a ring light, camera 1008 with a firstoptical element, lens 1006, and a part 1040 with a ball 1042 on thebottom surface. In one embodiment of the invention, the means ofillumination 1017 lights the bottom surface of the part 1040 to allowimaging the perimeter of the part 1040. In another embodiment of theinvention, overhead diffuser 1015 provides illumination for imaging ofthe perimeter of the part 1040.

In one example, the means for illumination may comprise reflected light,the lens 1006 may comprise a plurality of lens elements, a pin hole lensor a telecentric lens, and the processor 1012 may comprise a personalcomputer. Those skilled in the art will understand that the output ofthe sensor may be transmitted directly to memory without the use of aframe grabber.

A separate second optical element 1002 is positioned below the bottomplane of part 1040 to provide an additional perspective or side view1048 of the part 1040 containing an image of the ball 1052 of the part1040. In one embodiment of the invention, the optical element 1002 maycomprise a prism. In another embodiment of the invention, the opticalelement 1002 may comprise a mirror. As will be appreciated by oneskilled in the art, the invention will work with any number of sideviews. The camera 1008 is located below the central part of the part1040 to receive an image 1044 described in conjunction with FIGS. 18Aand 18B. In one embodiment of the invention, the camera 1008 comprisesan image sensor. The image sensor may be a charged coupled device arrayor a complementary metal oxide semiconductor device array. The camera1008 is connected to a frame grabber board 1010 to receive the image1044. The frame grabber board 1010 provides an image data output to aprocessor 1012 to perform a three dimensional inspection of the part1040 as described in conjunction with FIGS. 18A and 18B. The principlesand relationships shown in FIG. 6A and FIG. 6B apply. The processor 1012may store an image in memory 1014.

Now refer to FIGS. 18A and 18B which shows a ball grid array 1040 havingballs 1042. FIG. 18B shows a composite image 1044 of the ball grid array1040. The bottom view 1046 shows ball 1050 with a first perspective view1051 and a side view 1048 shows ball 1050 with crescent shape 1052 witha second perspective view. The system processor processes the compositeimage 1044 according to the system of equations described herein withthe bottom view 1046 and side view 1048 providing information for thesolution of the system of equations. The principles and relationshipsshown in FIG. 6A and FIG. 6B apply.

A method of manufacturing ball array devices using an inspectionapparatus having one or more cameras and ball array devices producedaccording to the method have been described. It will be understood bythose skilled in the art that the present invention may be embodied inother specific forms without departing from the scope of the inventiondisclosed and that the examples and embodiments described herein are inall respects illustrative and not restrictive. Those skilled in the artof the present invention will recognize that other embodiments using theconcepts described herein are also possible. Further, any reference toclaim elements in the singular, for example, using the articles “a,”“an,” or “the” is not to be construed as limiting the element to thesingular.

1. A method of manufacturing a ball array device having a plurality ofleads, the method comprising: providing a fixed optical imaging systemcomprising at least one camera; calibrating the fixed optical imagingsystem with a planar precision pattern disposed in a fixed position;obtaining a single bottom view image of the leads using the calibratedsystem; obtaining a single side view image of the leads using thecalibrated system; calculating an inspection result by combininginformation from the single bottom view image and the single side viewimage; and selecting the ball array device as a manufactured productusing the calculated inspection result.
 2. The method of claim 1,wherein the ball array device is selected from the group consisting of:ball grid array, ball grid array socket, bump on wafer, ceramic ballgrid array, chip array ball grid array, chip scale product, flip chipball grid array, flip chip scale product, high performance ball gridarray, land grid array, land grid array socket, leadless chip carrier,micro lead frame, plastic ball grid array, super ball grid array, superflip chip, system in a package, and thin chip array ball grid array. 3.The method of claim 1, wherein the plurality of leads is selected fromthe group consisting of: bumps, balls, columns, contacts, pads, pins,towers, posts, micro-pins, and pedestals.
 4. The method of claim 1,wherein the fixed optical imaging system comprises at least one camera,at least one lens, at least one illumination source, at least oneprocessor and memory.
 5. The method of claim 1, wherein the fixedoptical imaging system comprises a camera, optics, illumination and acomputer.
 6. The method of claim 1, wherein the planar precision patternis selected from the group consisting of: calibration reticle, precisionpattern that is generally planar, precision pattern of fiducialsdisposed on a generally planar surface, precision pattern on a metalsurface and precision pattern on a glass surface.
 7. The method of claim1, wherein the information from the single bottom view image and thesingle side view image is selected from the group consisting of: asubpixel position of the center of a donut shaped reflection, a subpixelposition of the center of a crescent shaped reflection, a subpixelposition of the top of a crescent shaped reflection, a subpixel positionof the center of an ellipse shaped reflection, a subpixel position ofthe top of an ellipse shaped reflection, a Db displacement in the singlebottom view image, a Ds displacement in the single side view image, aworld location, and a subpixel location relative to the stored locationsof at least three calibration fiducials.
 8. The method of claim 1,wherein the inspection result is selected from the group consisting of:pass, rework, invalid, not found, reject and fail.
 9. The method ofclaim 1, wherein the manufactured product is selected from the groupconsisting of: finished good, assembled ball array device, finished ballarray device, accepted ball array device, ball array device ready forpackaging, ball array device ready for shipping, and ball array deviceready to be passed on to a subsequent manufacturing step.
 10. The methodof claim 1, wherein calculating an inspection result comprisescalculating a Z value for each of the leads.
 11. The method of claim 1,wherein calculating an inspection result comprises calculating acoplanarity value for each of the leads.
 12. The method of claim 1,wherein calculating an inspection result comprises calculating acoplanarity value for each lead, calculating a maximum coplanarityvalue, and comparing the maximum coplanarity value to a predeterminedtolerance value.
 13. The method of claim 1, wherein selecting the ballarray device comprises providing a result signal to a part handler basedupon the inspection result.
 14. The method of claim 1, wherein selectingthe ball array device comprises selecting the ball array device as anacceptable device to be passed to a subsequent manufacturing step basedupon the inspection result.
 15. An electronic product comprising theball array device manufactured by the method of claim 1 wherein theelectronic product is selected from the group consisting of: automotivecontroller, personal computer, digital camera, graphics board, memorydevice, motherboard, music player, networking device, telephone, cellphone, television, video game console and video player.
 16. A method ofmanufacturing a ball array device having a plurality of leads, themethod comprising: providing a fixed optical imaging system comprisingat least one camera; calibrating the fixed optical imaging system with aplanar precision pattern disposed in a fixed focus position; obtaining abottom view image comprising donut shaped reflections from the leadsusing the calibrated system; obtaining a side view image comprisingcrescent shaped reflections from the leads using the calibrated system;finding locations of the donut shaped reflections from the leads;finding locations of the crescent shaped reflections from the leads;calculating a Z value for each lead by combining information from thelocations of the donut shaped reflections and the locations of thecrescent shaped reflections; calculating a coplanarity value for theball array device by using the Z value for each lead; and determining aninspection result by comparing the coplanarity value to a predeterminedtolerance value; and selecting the ball array device based upon theinspection result.
 17. A method of manufacturing a ball array devicehaving a plurality of leads, the method comprising: providing an imagingsystem with at least one camera, at least one lens, at least oneillumination source, at least one processor and memory; obtaining asingle bottom view image of the leads using the imaging system;obtaining a single side view image of the leads using the imagingsystem; finding a subpixel location of each lead in the single bottomview image; finding a subpixel location of each lead in the single sideview image; calculating a Z value for each lead by combining informationfrom the subpixel location of the lead in the single bottom view imageand the subpixel location of the same lead in the single side viewimage; calculating a coplanarity value for the ball array device byusing information from the Z value of each lead and parametersdetermined during a calibration; determining an inspection result bycomparing the coplanarity value to a predetermined tolerance value; andselecting the ball array device based upon the inspection result.
 18. Amethod of manufacturing a ball array device having a plurality of leads,the method comprising: providing a fixed optical imaging systemcomprising at least one camera, at least one lens, at least oneillumination source, at least one processor and memory; calibrating theimaging system with a planar precision pattern disposed in a fixed focusposition; obtaining a single bottom view image of the leads using thecalibrated imaging system; obtaining a single side view image of theleads using the calibrated imaging system; finding a subpixel locationof a reflection from each lead in the single bottom view image; findinga subpixel location of a reflection from each lead in the single sideview image; calculating a Z value for each lead by combining informationfrom the subpixel location of a reflection from the lead in the singlebottom view image and the subpixel location of the reflection from thesame lead in the single side view image; calculating a coplanarity valuefor the ball array device by using information from the Z value of eachlead; determining an inspection result by comparing the coplanarityvalue to a predetermined tolerance value; and selecting the ball arraydevice based upon the inspection result.
 19. A method of manufacturing aball array device having a plurality of leads, the method comprising:providing an imaging system comprising at least one camera; calibratingthe imaging system with a planar precision pattern disposed in a fixedfocus position; obtaining two differing views of the leads in at leastone image using the calibrated imaging system; obtaining a donut shapedreflection from each lead and a crescent shaped reflection from eachlead in the at least one image; finding at least two reference positionsof each lead in the at least one image; calculating a Z value of eachlead using the at least two reference positions of each lead;calculating a coplanarity value using information from the Z value ofeach lead; determining an inspection result by comparing the coplanarityvalue to a tolerance value; and selecting the ball array device as amanufactured product depending upon the inspection result.
 20. A ballarray device having a plurality of leads, the device being producedaccording to a process comprising: providing a fixed optical imagingsystem comprising at least one camera; calibrating the fixed opticalimaging system with a planar precision pattern disposed in a fixedposition; obtaining a single bottom view image of the leads using thecalibrated system; obtaining a single side view image of the leads usingthe calibrated system; calculating an inspection result by combininginformation from the single bottom view image and the single side viewimage; and selecting the ball array device as a manufactured productusing the calculated inspection result.
 21. The ball array device ofclaim 20, wherein the ball array device is selected from the groupconsisting of: ball grid array, ball grid array socket, bump on wafer,ceramic ball grid array, chip array ball grid array, chip scale product,flip chip ball grid array, flip chip scale product, high performanceball grid array, land grid array, land grid array socket, leadless chipcarrier, micro lead frame, plastic ball grid array, super ball gridarray, super flip chip, system in a package, and thin chip array ballgrid array.
 22. The ball array device of claim 20, wherein the pluralityof leads is selected from the group consisting of: bumps, balls,columns, contacts, pads, pins, towers, posts, micro-pins, and pedestals.23. The ball array device of claim 20, wherein the fixed optical imagingsystem comprises at least one camera, at least one lens, at least oneillumination source, at least one processor and memory.
 24. The ballarray device of claim 20, wherein the fixed optical imaging systemcomprises a camera, optics, illumination and a computer.
 25. The ballarray device of claim 20, wherein the planar precision pattern isselected from the group consisting of: calibration reticle, precisionpattern that is generally planar, precision pattern of fiducialsdisposed on a generally planar surface, precision pattern on a metalsurface and precision pattern on a glass surface.
 26. The ball arraydevice of claim 20, wherein the information from the single bottom viewimage and the single side view image is selected from the groupconsisting of: a subpixel position of the center of a donut shapedreflection, a subpixel position of the center of a crescent shapedreflection, a subpixel position of the top of a crescent shapedreflection, a subpixel position of the center of an ellipse shapedreflection, a subpixel position of the top of an ellipse shapedreflection, a Db displacement in the single bottom view image, a Dsdisplacement in the single side view image, a world location, and asubpixel location relative to the stored locations of at least threecalibration fiducials.
 27. The ball array device of claim 20, whereinthe inspection result is selected from the group consisting of: pass,rework, invalid, not found, reject and fail.
 28. The ball array deviceof claim 20, wherein the ball array device selected as a manufacturedproduct is selected from the group consisting of: finished good,assembled ball array device, finished ball array device, accepted ballarray device, ball array device ready for packaging, ball array deviceready for shipping, and ball array device ready to be passed on to asubsequent manufacturing step.
 29. The ball array device of claim 20,wherein calculating an inspection result comprises calculating a Z valuefor each of the leads.
 30. The ball array device of claim 20, whereincalculating an inspection result comprises calculating a coplanarityvalue for each of the leads.
 31. The ball array device of claim 20,wherein calculating an inspection result comprises calculating acoplanarity value for each lead, calculating a maximum coplanarityvalue, and comparing the maximum coplanarity value to a predeterminedtolerance value.
 32. An electronic product comprising the ball arraydevice of claim 20, wherein the electronic product is selected from thegroup consisting of: automotive controller, personal computer, digitalcamera, graphics board, memory device, motherboard, music player,networking device, telephone, cell phone, television, video game consoleand video player.
 33. A ball array device having a plurality of leads,the device being produced according to a process comprising: providing afixed optical imaging system comprising at least one camera; calibratingthe fixed optical imaging system with a planar precision patterndisposed in a fixed focus position; obtaining a bottom view imagecomprising donut shaped reflections from the leads using the calibratedsystem; obtaining a side view image comprising crescent shapedreflections from the leads using the calibrated system; findinglocations of the donut shaped reflections from the leads; findinglocations of the crescent shaped reflections from the leads; calculatinga Z value for each lead by combining information from the locations ofthe donut shaped reflections and the locations of the crescent shapedreflections; calculating a coplanarity value for the ball array deviceby using the Z value for each lead; and determining an inspection resultby comparing the coplanarity value to a predetermined tolerance value;and selecting the ball array device based upon the inspection result.34. A ball array device having a plurality of leads, the device beingproduced according to a process comprising: providing an imaging systemwith at least one camera, at least one lens, at least one illuminationsource, at least one processor and memory; obtaining a single bottomview image of the leads using the imaging system; obtaining a singleside view image of the leads using the imaging system; finding asubpixel location of each lead in the single bottom view image; findinga subpixel location of each lead in the single side view image;calculating a Z value for each lead by combining information from thesubpixel location of the lead in the single bottom view image and thesubpixel location of the same lead in the single side view image;calculating a coplanarity value for the ball array device by usinginformation from the Z value of each lead and parameters determinedduring a calibration; determining an inspection result by comparing thecoplanarity value to a predetermined tolerance value; and selecting theball array device based upon the inspection result.
 35. A ball arraydevice having a plurality of leads, the device being produced accordingto a process comprising: providing a fixed optical imaging systemcomprising at least one camera, at least one lens, at least oneillumination source, at least one processor and memory; calibrating theimaging system with a planar precision pattern disposed in a fixed focusposition; obtaining a single bottom view image of the leads using thecalibrated imaging system; obtaining a single side view image of theleads using the calibrated imaging system; finding a subpixel locationof a reflection from each lead in the single bottom view image; findinga subpixel location of a reflection from each lead in the single sideview image; calculating a Z value for each lead by combining informationfrom the subpixel location of a reflection from the lead in the singlebottom view image and the subpixel location of the reflection from thesame lead in the single side view image; calculating a coplanarity valuefor the ball array device by using information from the Z value of eachlead; determining an inspection result by comparing the coplanarityvalue to a predetermined tolerance value; and selecting the ball arraydevice based upon the inspection result.
 36. A ball array device havinga plurality of leads, the device being produced according to a processcomprising: providing an imaging system comprising at least one camera;calibrating the imaging system with a planar precision pattern disposedin a fixed focus position; obtaining two differing views of the leads inat least one image using the calibrated imaging system; obtaining adonut shaped reflection from each lead and a crescent shaped reflectionfrom each lead in the at least one image; finding at least two referencepositions of each lead in the at least one image; calculating a Z valueof each lead using the at least two reference positions of each lead;calculating a coplanarity value using information from the Z value ofeach lead; determining an inspection result by comparing the coplanarityvalue to a tolerance value; and selecting the ball array device as amanufactured product depending upon the inspection result.